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| BAT30 Series Small signal Schotky diodes Main product characteristics IF VRRM C (typ) Tj (max) 300 mA 30 V 14 pF 150 C BAT30JFILM (Single) SOD-323 BAT30KFILM (Single) SOD-523 Features and benefits Very low conduction losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode BAT30FILM (Single) SOT-23 BAT30AFILM (Common anode) BAT30SFILM (Series) BAT30CFILM (Common cathode) Description The BAT30 series uses 30 V Schotky barrier diodes encapsulated in a wide range of packages such as SOD-323, SOD-523, SOT-23, SOT-323, or SOT-666. This device is specially suited for switching mode applications needing low forward voltage drop diodes. BAT30WFILM (Single) BAT30CWFILM (Common cathode) BAT30AWFILM (Common anode) BAT30SWFILM (Series) Order codes Part Number BAT30FILM BAT30SFILM BAT30CFILM BAT30AFILM BAT30WFILM BAT30SWFILM BAT30CWFILM BAT30AWFILM BAT30JFILM BAT30KFILM BAT30-07P6FILM BAT30-09P6FILM Marking B30 S30 C30 A30 B30 S30 C30 A30 30 30 P3 Q3 SOT-323 BAT30-07P6FILM (2 parallel diodes) SOT-666 BAT30-09P6FILM (2 opposite diodes) Configurations in top view July 2006 Rev 1 1/12 www.st.com Characteristics BAT30 Series 1 Table 1. Symbol VRRM IF IFSM Tstg Tj TL Characteristics Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Maximum soldering temperature (1) Value 30 300 tp = 10 ms Sinusoidal 1 -65 to +150 150 260 Unit V mA A C C C 1. Pulse test: tp = 5 ms, < 2 % Table 2. Symbol Thermal parameters Parameter SOT-23 Value 500 550 600 C/W Unit Rth(j-a) Junction to ambient(1) SOT-323, SOD-323, SOD-523, SOT-666 1. On epoxy printed circuit board with recommended pad layout Table 3. Symbol Static electrical characteristics Parameter Test conditions VR = 5 V Tj = 25 C VR = 10 V VR = 25 V VR = 30 V Tj = 70 C Tj = 85 C 7 VR = 10 V IF = 0.1 mA IF = 1 mA IF = 10 mA 18 0.65 Min. Typ Max. 0.5 1 3 A 5 20 50 240 300 375 430 500 580 530 mV Unit IR(1) Reverse leakage current VF (2) Forward voltage drop Tj = 25 C IF = 30 mA IF = 100 mA IF = 200 mA IF = 300 mA 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % 2/12 BAT30 Series Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions VR = 0 V, F = 1 MHz Min. Typ 22 14 6 pF Max. Unit C Diode capacitance VR = 1 V, F = 1 MHz VR = 10 V, F = 1 MHz Figure 1. Power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature ( = 1) P (W) 0.175 =0.05 =0.2 =0.1 =0.5 =1 IF(AV) (A) 0.35 0.30 0.25 0.20 0.15 0.150 0.125 0.100 0.075 0.050 0.025 T 0.10 0.05 0.00 T IF(AV) (A) 0.000 0.00 0.05 0.10 0.15 0.20 =tp/T 0.25 0.30 tp 0.35 =tp/T 0 25 tp 50 Tamb ( C) 75 100 125 150 Figure 3. Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-23) Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-323 / SOD-323) Zth(j-a) /Rth(j-a) 1.E+00 Single pulse SOT-23 Zth(j-a) /Rth(j-a) 1.E+00 Single pulse SOT-323/SOD-323 1.E-01 1.E-01 1.E-02 Alumine substrate 10 x 8 x 0.5 mm 1.E-02 1.E-03 tP(s) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 tP(s) 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Epoxy FR4 SCU=2.25 mm eCU=35 m 1.E+02 1.E+03 3/12 Characteristics BAT30 Series Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-666) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-523) Zth(j-a) /Rth(j-a) 1.E+00 Single pulse SOT-666 Zth(j-a) /Rth(j-a) 1.E+00 Single pulse SOD-523 1.E-01 1.E-01 1.E-02 tP(s) 1.E-02 1.E-03 1.E-02 1.E-01 Epoxy FR4 eCU=35 m tP(s) Epoxy FR4 eCU=35 m 1.E-03 1.E+00 1.E+01 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-323) Figure 8. Leakage current versus reverse applied voltage (typical values) Rth(j-a) (C/W) 600 Epoxy FR4 eCU=35 m 1.E-02 IR (A) Tj=150C 1.E-03 500 Tj=125C 1.E-04 400 Tj=85C 1.E-05 300 1.E-06 SCU(mm) Tj=25C 200 0 5 10 15 1.E-07 20 25 30 35 40 45 50 VR (V) 0 5 10 15 20 25 30 Figure 9. Relative variation of reverse leakage current versus junction temperature (typical values) Figure 10. Junction capacitance versus reverse applied voltage (typical values) C(pF) 100 F=1 MHz VOSC=30 mVRMS Tj=25 C IR[T j] / IR[T j=25C] 1.E+04 VR=30 V 1.E+03 1.E+02 10 1.E+01 1.E+00 1.E-01 Tj(C) 1.E-02 -40 -20 0 20 40 60 80 100 120 140 160 1 1 10 100 VR(V) 4/12 BAT30 Series Ordering information scheme Figure 11. Forward voltage drop versus forward current (typical values) IFM(A) 1.E+01 Figure 12. Forward voltage drop versus forward current (typical values) IFM(A) 1.E+01 1.E+00 Tj=150 C 1.E+00 1.E-01 Tj=85 C 1.E-01 Tj=125 C 1.E-02 1.E-02 Tj=25 C 1.E-03 Tj=-40 C 1.E-03 VFM(V) 1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 1.E-04 0.9 1.0 1.1 1.2 1.3 VFM(V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 0.7 0.8 2 Ordering information scheme BAT30 Signal Schotky diodes VRRM = 30 V Configuration Blank = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 W = SOT-323 K = SOD-523 P6 = SOT-666 Packing FILM = Tape and reel xx xx FILM 5/12 Package information BAT30 Series 3 Package information Epoxy meets UL94, V0 Table 5. SOD-323 dimensions Dimensions Ref. H b E A1 Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 A A1 D A b c 0.01 0.004 0.06 0.044 0.09 0.004 0.004 c Q1 D E L H L Q1 Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.30 1.06 1.08 1.06 6/12 BAT30 Series Table 6. SOD-523 dimensions Package information Dimensions E 0.15 M C A B E1 B Ref. Millimeters Min. Typ. 0.60 1.60 1.20 0.80 Max. 0.70 1.70 1.30 0.90 0.35 0.20 0.20 0.25 0.20 Min. 0.020 0.059 0.043 0.028 0.010 0.003 0.006 0.004 Inches Typ. 0.024 0.063 0.047 0.031 Max. 0.028 0.067 0.051 0.035 0.014 0.008 0.008 0.010 0.008 2xb D A E 8 0.50 1.50 1.10 0.70 0.25 0.07 0.15 0.10 0.20 M C A B A R0.1 E1 A SEATING PLANE c C L 7 D b c L1 L L1 Figure 14. SOD-523 footprint (dimensions in mm) 0.7 0.3 2 7/12 Package information Table 7. SOT-23 dimensions Dimensions Ref. A E BAT30 Series Millimeters Min. Max. 1.4 0.1 0.51 0.18 3.04 1.05 2.1 1.6 2.75 0.6 typ. 0.35 0.65 Inches Min. 0.035 0 0.012 0.003 0.108 0.033 0.067 0.047 0.083 Max. 0.055 0.004 0.02 0.007 0.12 0.041 0.083 0.063 0.108 A A1 e B e1 D 0.89 0 0.3 0.085 2.75 0.85 1.7 1.2 2.1 B c S A1 D e e1 L H c E H L S 0.024 typ. 0.014 0.026 Figure 15. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25 8/12 BAT30 Series Table 8. SOT-323 dimensions Package information Dimensions A E Ref. Millimeters Min. Typ. Max. 1.1 0.1 0.4 0.26 2.0 1.25 0.65 1.8 0.1 0 2.1 0.2 2.4 0.3 30 0.071 0.004 0 2.2 1.35 Min. 0.031 0.0 0.010 0.004 0.071 0.045 Inches Typ. Max. 0.043 0.004 0.016 0.010 0.079 0.049 0.026 0.083 0.008 0.094 0.012 30 0.086 0.053 A e b D 0.8 0.0 0.25 0.1 1.8 1.15 A1 b c A1 D E e c H L H L q Figure 16. SOT-323 footprint (dimensions in mm) 0.95 1.0 2.9 0.8 0.50 9/12 Package information Table 9. SOT-666 dimensions BAT30 Series Dimensions b1 L1 Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 L3 b A A3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27 0.60 0.018 0.18 0.003 0.34 0.007 b1 D 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051 A E L2 E A3 E1 e L1 L2 e L3 Figure 17. SOT-666 footprint (dimensions in mm) 0.50 0.62 2.60 0.99 0.30 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 10/12 BAT30 Series Ordering information 4 Ordering information Part Number BAT30FILM BAT30SFILM BAT30CFILM BAT30AFILM BAT30WFILM BAT30SWFILM BAT30CWFILM BAT30AWFILM BAT30JFILM BAT30KFILM BAT30-07P6FILM BAT30-09P6FILM Marking B30 S30 C30 A30 B30 S30 C30 A30 30 30 P3 Q3 Package SOT-23 Single SOT-23 Serial SOT-23 Common cathode SOT-23 Common anode SOT-323 Single SOT-323 Serial SOT-323 Common cathode SOT-323 Common anode SOD-323 SOD-523 SOT-666 Parallel SOT-666 Opposite Weight 10 mg 10 mg 10 mg 10 mg 6 mg 6 mg 6 mg 6 mg 5 mg 1.4 mg 2.9 mg 2.9 mg Base qty 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 5000 5000 Delivery mode Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel 5 Revision history Date 24-Jul-2006 Revision 1 First issue Description of Changes 11/12 BAT30 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12 |
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